Laser Technologies Promote New Opportunities for the Development of Pan-Semiconductor Industry

Laser Forum at Hall OW6,Shanghai New International Expo Centre (SNIEC)

Introduction

The Pan-semiconductor industry includes semiconductor integrated circuit manufacturing, new energy photovoltaic manufacturing, advanced display manufacturing, LED and other industries. With China government pay increasing attention to the semiconductor, new energy, new displays and other industries’ development, the Pan-semiconductor industry has a strong development foundation and market potential in the Chinese market.Laser, as an advanced precision machining tool, plays an indispensable and crucial role in the development of numerous process links in the Pan-semiconductor industry.

On March 20, during the LASER World of PHOTONICS CHINA 2024, Laser Focus World China magazine will hold a LaserFocusCon seminar, which will focus on the topic of "How laser technologies could help pan-semiconductor industry achieve new developing opportunities". Just stay tuned!

 

Information

Time: March 20, 2024

Venue: Laser Forum at Hall OW6,Shanghai New International Expo Centre (SNIEC)

Fee: Free

 

Organizers

Messe Muenchen Shanghai Co., Ltd.

ACT International

   

Media

< Laser Focus World China>

 

Supporting

Sponsors(Rank in no particular order)

  

Topics

  • The applications of laser technology in wafer manufacturing
  • Measurement and inspection technologies for wafer packaging and testing
  • Application of precision motion control platform in semiconductor manufacturing
  • Laser processing technologies used in photovoltaic cell manufacturing
  • Laser technologies used in advanced display manufacturing
  • Laser technologies used in LED chip manufacturing
  • Other related topics

 

Agenda

  • 09:30-10:20

       Registration

 

  • 10:20-10:30

Adonis Mak ,Publishing director,President;《Laser Focus World China》 、ACT International

Topic:Welcome Speech

 

  • 10:30-10:50

Expert presentation Ye Dai,Shanghai University,Professor,Ph.D. supervisor,Vice Dean of College of Sciences

Topic:Phenomena and mechanism on chirped femtosecond laser processing

 

  • 10:50-11:10

WTN,BWT,Deputy General Manager of BWT's Ultrafast Business Unit

Topic:The main applications of lasers in the pan semiconductor industry

 

  • 11:10-11:30

Feng Zhao,SCANLAB GmbH , Solution Engineer

Topic:Taking Laser Scanning to the Next Level with SCANmotionControl Software

 

  • 11:30-11:50

Wei Cheng,HGTECH,CTO

Topic:The Application of Beam Shaping in Ultrafast Laser Micromachining of Transparent Brittle Materials

 

  • 11:50-13:50

       Rest Time

 

  • 13:50-14:00

       Lucky draw

 

  • 14:00-14:20

Expert presentation Lingling Zhang,Shanghai Institute of Laser technology Ltd.,Deputy chief Engineer

Topic:Investigations on laser soft marking of Si wafer

 

  • 14:20-14:40

Donfi Cai,GF Machining Solutions, Laser Product Manager of GF Machining Solutions

Topic:Laser empowers semiconductor precision parts manufacturing process

 

  • 14:40-15:00

Derek Ling,Physik Instrumente(PI), Product Marketing Manager

Topic:PI Metro Demonstrator – a precision positioning system for film metrology in semiconductor wafer inspection

 

  • 15:00-15:20

York Zhang, Dogain Optoelectronic Technology(suzhou)Co., Ltd. , President

Topic:Application And Key Technology Of Semiconductor Laser In Pan-semiconductor Industry 

 

  • 15:20-15:40

Expert presentation Qiang Hao,University of Shanghai for Science and Technology,Associate Professor

Topic:The technologies and applications of ultrafast fiber laser sources

 

For most updated information, please refer to the conference schedule posted.


Contact

Messe Muenchen Shanghai Co., Ltd.

Ms. Grace Qu

Tel: +86-(0)21-2020 5543

E-mail: grace.qu@mm-sh.com

Messe München GmbH

Messegelände

81823 München

Tel: +49 89 949-20720
Fax: +49 89 949-20729
info@messe-muenchen.de

MMI (Shanghai) Co., Ltd.

11th floor, GC Tower, 1088 Yuanshen Rd

Shanghai

Tel: +86 21 2020 5500
Fax: +86 21 2020 5688
info@mm-sh.com