Laser Technologies Promote New Opportunities for the Development of Pan-Semiconductor Industry
Introduction
The Pan-semiconductor industry includes semiconductor integrated circuit manufacturing, new energy photovoltaic manufacturing, advanced display manufacturing, LED and other industries. With China government pay increasing attention to the semiconductor, new energy, new displays and other industries’ development, the Pan-semiconductor industry has a strong development foundation and market potential in the Chinese market.Laser, as an advanced precision machining tool, plays an indispensable and crucial role in the development of numerous process links in the Pan-semiconductor industry.
On March 20, during the LASER World of PHOTONICS CHINA 2024, Laser Focus World China magazine will hold a LaserFocusCon seminar, which will focus on the topic of "How laser technologies could help pan-semiconductor industry achieve new developing opportunities". Just stay tuned!
Information
Time: March 20, 2024
Venue: Laser Forum at Hall OW6,Shanghai New International Expo Centre (SNIEC)
Fee: Free
Organizers
Messe Muenchen Shanghai Co., Ltd.
ACT International
Media
< Laser Focus World China>
Supporting
Sponsors(Rank in no particular order)
Topics
- The applications of laser technology in wafer manufacturing
- Measurement and inspection technologies for wafer packaging and testing
- Application of precision motion control platform in semiconductor manufacturing
- Laser processing technologies used in photovoltaic cell manufacturing
- Laser technologies used in advanced display manufacturing
- Laser technologies used in LED chip manufacturing
- Other related topics
Agenda
- 09:30-10:20
Registration
- 10:20-10:30
Adonis Mak ,Publishing director,President;《Laser Focus World China》 、ACT International
Topic:Welcome Speech
- 10:30-10:50
Expert presentation Ye Dai,Shanghai University,Professor,Ph.D. supervisor,Vice Dean of College of Sciences
Topic:Phenomena and mechanism on chirped femtosecond laser processing
- 10:50-11:10
WTN,BWT,Deputy General Manager of BWT's Ultrafast Business Unit
Topic:The main applications of lasers in the pan semiconductor industry
- 11:10-11:30
Feng Zhao,SCANLAB GmbH , Solution Engineer
Topic:Taking Laser Scanning to the Next Level with SCANmotionControl Software
- 11:30-11:50
Wei Cheng,HGTECH,CTO
Topic:The Application of Beam Shaping in Ultrafast Laser Micromachining of Transparent Brittle Materials
- 11:50-13:50
Rest Time
- 13:50-14:00
Lucky draw
- 14:00-14:20
Expert presentation Lingling Zhang,Shanghai Institute of Laser technology Ltd.,Deputy chief Engineer
Topic:Investigations on laser soft marking of Si wafer
- 14:20-14:40
Donfi Cai,GF Machining Solutions, Laser Product Manager of GF Machining Solutions
Topic:Laser empowers semiconductor precision parts manufacturing process
- 14:40-15:00
Derek Ling,Physik Instrumente(PI), Product Marketing Manager
Topic:PI Metro Demonstrator – a precision positioning system for film metrology in semiconductor wafer inspection
- 15:00-15:20
York Zhang, Dogain Optoelectronic Technology(suzhou)Co., Ltd. , President
Topic:Application And Key Technology Of Semiconductor Laser In Pan-semiconductor Industry
- 15:20-15:40
Expert presentation Qiang Hao,University of Shanghai for Science and Technology,Associate Professor
Topic:The technologies and applications of ultrafast fiber laser sources
For most updated information, please refer to the conference schedule posted.
Contact
Messe Muenchen Shanghai Co., Ltd.
Ms. Grace Qu
Tel: +86-(0)21-2020 5543
E-mail: grace.qu@mm-sh.com